fabrications

英 [ˌfæbrɪˈkeɪʃənz]

美 [ˌfæbrɪˈkeɪʃənz]

n.  制造，建造，装配，制作; 虚构的事情，尤指无稽之谈；谎言；捏造的托词; 构造物；构成部分
fabrication的复数

柯林斯词典

• VERB 编造;捏造
  If someonefabricatesinformation, they invent it in order to deceive people.
  1. All four claim that officers fabricated evidence against them...
     4 人全都声称警察捏造证据陷害他们。
  2. Eleven key officials were hanged on fabricated charges.
     11位高官因莫须有的罪名被处以绞刑。
• VERB 制造;制作
  If somethingis fabricated fromdifferent materials or substances, it is made out of those materials or substances.
  1. All the tools are fabricated from high quality steel.
     所有工具均由精钢制成。
  2. ...a plant which fabricates airplane components.
     一家制造飞机配件的工厂

双语例句

• Her story was nothing but a series of fabrications.
  她说的完全都是编造的。
• What are Acheson's wild fabrications about modern Chinese history?
  艾奇逊胡诌的中国近代史是什么呢？
• Such notions, of course, are gross fabrications that lead to a dangerous ignorance.
  当然，这种观念是粗俗的，危险的是还会使人无知。
• InSb MIS construction theory interface Characteristics, device design sad fabrications are briefly reviewed tn this paper.
  本文介绍了InSbMIS结构理论和界面电学特性分析；结构设计和工艺实现途径。
• A new technical achievement& the multifunctional GC-J1 type optical fiber transmission system, the design principles, fabrications, investigation results and analysis discussions of it has been reported.
  本文报告了一项新技术成果多功能GCJ1型光纤传输系统的设计原理、制作、结果和分析讨论。
• The materials and methods for the fabrications of these microelectrode arrays are summarized.
  总结制作这类电极的材料与方法；
• Hello. This is the Johnson Fabrications.
  你好，我是强生制造公司。
• A Real-Time Scheduling Algorithm of Wet-Etching System with Residency Constraints in Semiconductor Wafer Fabrications
  基于驻留约束的半导体晶圆蚀刻系统实时调度算法
• This is owing to novelist can haul the fact into another scene and cast totally different ray of light by their skillful lies and lifelike fabrications.
  这是因为，小说家能够通过巧妙说谎、通过栩栩如生的虚构而将真相拽到另一场所投以另一光照。
• The fabrications of glass microfluidic chips by using photolithograph, wet etching and thermal bonding methods and PMMA microfluidic chip by hot embossing and direct bonding methods were studied.
  采用热压和键合的方法制作玻璃和有机聚合物（PMMA）芯片，对玻璃和PMMA芯片在高压直流电场作用下的伏安特性进行了研究和分析。